发明名称 MAXIMIZING SURFACE AREA OF SURFACE MOUNT CONTACT PADS OF CIRCUIT BOARD ALSO HAVING VIA CONTACT PADS
摘要 A circuit board has a first side and a second side opposite thereto. The board includes vias extending through the substrate from the first side to the second side, and via contact pads on the second side, each of which surrounds a corresponding via. The board includes a pair of surface mount contact pads on the second side. Each surface mount contact pad has a surface area and edges, each of which can have a shape to maximize the surface area while maintaining predetermined minimum separation distances. Each edge except one or more edges that are opposite another surface mount contact pad have a curved shape, and each edge opposite another surface mount contact pad have a linear shape. Curved edges adjacently opposite corresponding via contact pads can have curved shapes can have concave shapes, and curved edges not adjacently opposite via contact pads can have convex shapes.
申请公布号 US2016066424(A1) 申请公布日期 2016.03.03
申请号 US201414473509 申请日期 2014.08.29
申请人 LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD. 发明人 Ao Eric R.;Flint Stephen J.;Hogan Michael W.J.;McGale Shannon D.;Salinas Rodolfo B.
分类号 H05K1/11;H05K3/40;H05K1/18 主分类号 H05K1/11
代理机构 代理人
主权项 1. A circuit board comprising: a substrate having a first side and a second side opposite the first side; a plurality of vias extending through the substrate from the first side to the second side; a plurality of via contact pads on the second side, each via contact pad surrounding a corresponding via; and a pair of surface mount contact pads on the second side, each surface mount contact pad having a surface area and one or more first edges adjacently opposite corresponding via contact pads, each first edge having a shape to maximize the surface area while maintaining a first predetermined minimum distance to a closet via contact pad.
地址 New Tech Park SG
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