发明名称 SiC MOLDED BODY AND METHOD FOR PRODUCING SiC MOLDED BODY
摘要 A CVD-SiC formed body has low light transmittance and high resistivity, and may suitably be used as a member for an etcher that is used for a semiconductor production process, for example. The SiC formed body is formed using a CVD method, and includes 1 to 30 mass ppm of boron atoms, and more than 100 mass ppm and 1000 mass ppm or less of nitrogen atoms. The SiC formed body preferably has a resistivity of more than 10 ©·cm and 100,000 ©·cm or less, and a light transmittance at a wavelength of 950 nm of 0 to 1%.
申请公布号 EP2881494(A4) 申请公布日期 2016.03.02
申请号 EP20120882269 申请日期 2012.09.13
申请人 TOKAI CARBON CO., LTD. 发明人 SUGIHARA TAKAOMI;ASAKURA MASAAKI;TOKUNAGA TAKESHI;SADAKI TETSUYA
分类号 C23C16/42;C01B31/36;C04B35/565;C23C16/01;C23C16/32 主分类号 C23C16/42
代理机构 代理人
主权项
地址