| 摘要 |
The power component has a power semiconductor component comprising a contact surface that is connected with a partial foil (40) and a contact surface (310a) of another power semiconductor component (3a) e.g. power diode, in an electrically conductive manner. A conductive path (24) of a substrate (2) is electrically insulated by another conductive path (22), and comprises a contact surface (244), which is mechanically, indirectly or directly connected with the partial foil and the contact surface of the semiconductor component in an electrically conductive manner. |
