| 摘要 |
The present invention relates to an apparatus to thermally treat a substrate by enabling air to circulate to enable a heated air to pass through a substrate. The apparatus to thermally treat a substrate comprises: a chamber unit comprising a substrate loading unit where one or more substrates are loaded, having a circulation path where the air is introduced from an inlet to be discharged to an outlet; a first heating unit installed in the circulation path to heat the air introduced to the chamber unit; a circulation unit enabling the air to circulate inside the chamber unit; and a second heating unit installed in at least one among an upper and a lower portion of the substrate loading unit to heat the air inside the chamber unit. As such, the present invention compensates a temperature of the upper and lower portions of the chamber and a peripheral region of a shutter to maintain a uniform temperature of the inside of the chamber; reduces a time consumed for a thermal treatment process using the first and second heating units; and improves thermal treatment efficiency of the substrate. |
