METHOD FOR DIVIDING BRITTLE MATERIAL SUBSTRATE, SUBSTRATE HOLDING MEMBER FOR DIVIDING BRITTLE MATERIAL SUBSTRATE, AND FRAME BODY FOR ATTACHING ADHESIVE FILM FOR USE IN DIVIDING BRITTLE MATERIAL SUBSTRATE

摘要

Provided is a method which can reduce costs required for dividing a brittle material substrate, and at the same time, can not cause inconvenience in executing extension during a post process. A method for dividing a brittle material substrate comprises: a scribe line forming process of forming a scribe line at a dividing target position of one circumferential surface side of the brittle material substrate; a substrate attachment process of attaching the one circumferential surface side of the brittle material substrate formed with the scribe line to an adhesive film of a substrate support member which is formed by attaching the adhesive film to a frame body; and a dividing process of dividing the brittle material substrate by lifting down a front end of an upper blade to contact a dividing expected position of the other circumferential surface side corresponding to a forming position of the scribe line, under the state that the brittle material substrate is supported from a lower side. The frame body is in a rectangular ring shape. The length of one side of an attachable region of the brittle material substrate in the substrate supporting member is 1.2-1.4 times a maximum outer size of the brittle material substrate.