Method and apparatus pertaining to a cavity-bearing printed circuit board

摘要

A printed circuit board has a cavity formed in at least one side thereof and an electronic component disposed at least partially within that cavity. Electromagnetic interference (EMI)-shielding material is disposed between the electronic component and at least one of the side walls and bottom of this cavity. So configured, the overall height of the combined structure is reduced as compared to a surface-mounted component.

主权项

1. An apparatus, comprising:
a printed circuit board having a cavity formed on a first side thereof, the cavity having side walls and a bottom; a substrate positionable with respect to the circuit board; an electronic component electrically connected to the substrate and positionable in connection with the substrate to be disposed at least partially in the cavity, with a portion of the electronic component extending above the first side of the printed circuit board; and electromagnetic interference (EMI)-shielding foam disposed adjacent to at least a portion of the electronic component, the foam compressed between the substrate and the circuit board when the electronic component is disposed at least partially in the cavity.