发明名称 Method for S/TEM sample analysis
摘要 An improved method and apparatus for S/TEM sample preparation and analysis. Preferred embodiments of the present invention provide improved methods for TEM sample creation, especially for small geometry (<100 nm thick) TEM lamellae. Preferred embodiments of the present invention also provide an in-line process for S/TEM based metrology on objects such as integrated circuits or other structures fabricated on semiconductor wafer by providing methods to partially or fully automate TEM sample creation, to make the process of creating and analyzing TEM samples less labor intensive, and to increase throughput and reproducibility of TEM analysis.
申请公布号 US9275831(B2) 申请公布日期 2016.03.01
申请号 US201414546244 申请日期 2014.11.18
申请人 FEI Company 发明人 Arjavac Jason;Zou Pei;Tasker David James;Otten Maximus Theodorus;Daniel Gerhard
分类号 H01J37/28;H01J37/305;G01N1/06;G01N1/08;G01N1/28;G01N23/04;G01N1/32;H01J37/26;H01J37/06;H01J37/18;H01J37/20 主分类号 H01J37/28
代理机构 Scheinberg & Associates, PC 代理人 Scheinberg & Associates, PC ;Scheinberg Michael O.;Calvert Nathan H.
主权项 1. A method for TEM analysis of multiple samples from two or more sites on a substrate, comprising: selecting a set of process parameter values for each of the samples, said process parameter values including positional data for each sample site to be analyzed and including instructions for processing, extracting, and analyzing samples; loading the substrate into a charged particle beam system, said charged particle beam system to process the substrate according to one or more of the selected process parameter values; automatically navigating to the two or more sample sites using said positional data; automatically imaging the sample sites and, according to one or more of the selected process parameter values, performing image recognition to determine the precise position of respective target structure for each sample site by searching for a specified pattern indicating the target structure; based on the determined precise position, automatically creating precision fiducial markings at desired locations with respect to the target structure; using the precision fiducial markings as a reference, automatically milling the substrate surface on either side of the desired sample locations leaving a thin vertical layer of material comprising a sample to be analyzed; extracting the samples from the substrate and placing each sample at a designated location on a sample holder; transferring the samples to a TEM system, said TEM importing the process parameter values for each sample and the TEM also imaging and analyzing the samples according to one or more of the selected process parameter values; imaging the samples with the TEM; and analyzing the TEM images to obtain information about the samples.
地址 Hillsboro OR US