System and method for an improved interconnect structure

摘要

Presented herein are an interconnect structure and method for forming the same. The interconnect structure comprises a contact pad disposed over a substrate and a connector disposed over the substrate and spaced apart from the contact pad. A passivation layer is disposed over the contact pad and over connector, the passivation layer having a contact pad opening, a connector opening and a mounting pad opening. A post passivation layer comprising a trace and a mounting pad is disposed over the passivation layer. The trace may be disposed in the contact pad opening and contacting the mounting pad, and further disposed in the connector opening and contacting the connector. The mounting pad may be disposed in the mounting pad opening and contacting the opening. The mounting pad separated from the trace by a trace gap, which may optionally be at least 10 μm.

主权项

1. An interconnect structure, comprising:
a connector disposed over a substrate and at a second level below a first level, the substrate having a major surface; an insulating layer disposed over the substrate and over the connector; a mounting pad disposed over the insulating layer and at the first level, the mounting pad electrically connected to the connector; a trace disposed over the insulating layer and at the first level and having a major axis extending in a direction parallel to the major surface of the substrate, the trace electrically connected to the connector and electrically connected to the mounting pad by way of the connector, the trace spaced apart from the mounting pad in a direction parallel to the major surface of the substrate; a contact pad disposed over the substrate and at the second level, the contact pad electrically connected to and in physical contact with the trace; and a mounting structure disposed on the mounting pad.