发明名称 照明器具
摘要 The present invention suppresses, with a simple configuration, warpage of a light source substrate without causing deterioration of heat dissipation performance. According to an embodiment of the present invention, a light source (3) is provided with: a light source substrate (11), which is provided with a wiring pattern; a plurality of semiconductor light emitting elements (18), which are mounted on the light source substrate (11) by being connected to the wiring pattern; and a reflecting plate (21), which covers the light source substrate (11) such that the reflecting plate faces the light source substrate (11). The reflecting plate (21) has a plurality of metal reflecting surfaces (29) that face each other by each of the semiconductor light emitting elements (18). The reflecting surfaces (29) are separated from the semiconductor light emitting elements (18) and the light source substrates (11) by insulating distances. At least one protruding portion (27) in contact with the light source substrate (11) is protruding from the rear surface of the reflecting plate (21) by having the position of the protruding portion shifted from openings (26) in the reflecting surfaces (29).
申请公布号 JP5871402(B2) 申请公布日期 2016.03.01
申请号 JP20130520392 申请日期 2011.06.17
申请人 東芝ライテック株式会社 发明人 村田 淳哉;岡 義郎;森山 厳與
分类号 F21S2/00;F21V19/00;F21V29/503 主分类号 F21S2/00
代理机构 代理人
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