Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip

摘要

According to an exemplary embodiment, a power module is provided which comprises a semiconductor chip, a bonding substrate comprising an electrically conductive sheet and an electric insulator sheet which is directly attached to the electrically conductive sheet and which is thermally coupled to the semiconductor chip, and an array of cooling structures directly attached to the electrically conductive sheet and configured for removing heat from the semiconductor chip when interacting with cooling fluid.

主权项

1. A power module, comprising:
a semiconductor chip having a first main surface and a second main surface opposing the first main surface; a first bonding substrate having a first bonding surface coupled to the first main surface of the semiconductor chip and having a first heat removal surface opposing the first bonding surface; a second bonding substrate having a second bonding surface coupled to the second main surface of the semiconductor chip and having a second heat removal surface opposing the second bonding surface; a first cooling structure on the first heat removal surface configured for removing heat from the semiconductor chip when interacting with cooling fluid; and a second cooling structure on the second heat removal surface configured for removing heat from the semiconductor chip when interacting with cooling fluid; wherein at least one of the first cooling structure and the second cooling structure comprises an array of cooling loops; wherein the array of cooling loops comprises at least one of the group consisting of meandrically bent bond wires and meandrically bent bond ribbons.