| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance the adhesion between an aluminum wire and a plating layer and improve solder wettability. <P>SOLUTION: A capacitor element 1, including cathode foil and anode foil and holding an electrolyte, and an aluminum wire 2, connected with the capacitor element 1, are sealed by an exterior member 3, and a part of the aluminum wire 2 is led out from a lead-out part 4 of the exterior member to the exterior. Treatment is performed on the part of the aluminum wire 2 to roughen the surface. A plating layer 6 is formed on the roughened surface of the aluminum wire 2. The roughening process is conducted by performing blast treatment where polygonal particles are blown onto the surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
