| 摘要 |
The invention provides a high thermal conductivity membrane adhesive, an adhesive composition and a semiconductor package using the adhesive and a manufacturing method thereof. The high thermal conductivity membrane adhesive composition is characterized by including epoxy resin (A), an epoxy hardener (B), an inorganic filler (C) and phenoxy resin (D). The inorganic filler (C) meets all the flowing conditions of (i)-(iii) and the content of the inorganic filler (C) is 30-70 volume%: (i) a mean grain size being 0.1-5.0 [mu] m; (ii) moh 's hardness being 1-8; (iii) thermal conductivity being above 30 w/ (m.k). |
