| 发明名称 |
BONDED MEMBER AND METHOD FOR PRODUCING THE SAME |
| 摘要 |
A microchip plate according to an embodiment includes a first substrate, a second substrate, and an adhesive layer, the first substrate and the second substrate being bonded to each other with the adhesive layer provided therebetween, in which each of the first substrate and the second substrate is composed of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC), and the adhesive layer contains a polymer of α-olefin. |
| 申请公布号 |
US2016052238(A1) |
申请公布日期 |
2016.02.25 |
| 申请号 |
US201514930280 |
申请日期 |
2015.11.02 |
| 申请人 |
Alps Electric Co., Ltd. |
发明人 |
Taniguchi Yoshinao |
| 分类号 |
B32B7/12;C09J123/24;B32B37/12;B32B27/08;B32B27/32 |
主分类号 |
B32B7/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bonded member comprising:
a first substrate; a second substrate; and an adhesive layer, the first substrate and the second substrate being bonded to each other with the adhesive layer provided therebetween, wherein each of the first substrate and the second substrate is composed of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC), and the adhesive layer contains a polymer of α-olefin. |
| 地址 |
Tokyo JP |
