发明名称 GYPSUM BOARD MANUFACTURING METHOD AND MANUFACTURING DEVICE
摘要 As a lower forming plate 8, a forming plate having: a lower plate main body 10 constituted from an electrically conductive material; and a lower embedded electrode 12 embedded in the lower plate main body 10, the lower embedded electrode 12 being electrically insulated from the lower plate main body 10 by an insulator 14 and being embedded so as for a portion thereof to be exposed on the surface of the lower plate main body 10 making contact with a lower lining paper sheet 16 is used.
申请公布号 US2016052167(A1) 申请公布日期 2016.02.25
申请号 US201414779178 申请日期 2014.03.24
申请人 YOSHINO GYPSUM CO., LTD. 发明人 YOSHIDA Tsuyoshi;HIMENO Akira;NOGUCHI Tomohiro
分类号 B28B19/00;B28B7/00 主分类号 B28B19/00
代理机构 代理人
主权项 1. A method for producing a gypsum board, the method comprising a step of continuously injecting a gypsum slurry into a gap between a pair of upper and lower lining paper sheets while continuously supplying the pair of upper and lower lining paper sheets to form a laminated material and allowing the laminated material to pass between a pair of upper and lower forming plates to obtain a molded body having a thickness depending on a space between the plates, wherein a forming plate comprising: a plate main body constituted from an electrically conductive material; and an embedded electrode embedded in the plate main body, the embedded electrode being electrically insulated from the plate main body by an insulator and being embedded so as for a portion thereof to be exposed on a surface of the plate main body making contact with the lining paper sheet is used as at least one of the pair of upper and lower forming plates, a circuit is constituted by electrically connecting the plate main body and the embedded electrode embedded in the plate main body, and voltage is applied to the circuit, and when the lining paper sheet is cut to bring the plate main body and the embedded electrode into contact with the gypsum slurry and an electric current flows in the circuit, the space between the pair of upper and lower forming plates is expanded to remove a cause of conduction, and thereafter the space between the pair of upper and lower forming plates is restored to the original space.
地址 Tokyo JP