SEMICONDUCTOR DEVICE EMPLOYING ALUMINUM ALLOY LEAD-FRAME WITH ANODIZED ALUMINUM

摘要

A semiconductor device comprises an aluminum alloy lead-frame with a passivation layer covering an exposed portion of the aluminum alloy lead-frame. Since aluminum alloy is a low-cost material, and its hardness and flexibility are suitable for deformation process, such as punching, bending, molding and the like, aluminum alloy lead frame is suitable for mass production; furthermore, since its weight is much lower than copper or iron-nickel material, aluminum alloy lead frame is very convenient for the production of semiconductor devices.

主权项

1. A semiconductor device comprising:
a chip mounting unit comprising a die paddle and a plurality of pins arranged close to the die paddle; a semiconductor chip attached onto a front side of the die paddle; a plurality of interconnection structures for electrically connecting each bonding pad arranged on a front side of the semiconductor chip to a bonding part of a corresponding pin close to the die paddle; a plastic package body covering the front side of the die paddle, the semiconductor chip, the interconnection structures and the bonding parts of the pins; a metal layer formed at the front side of the die paddle and a surface of each pin; and a passivation layer formed at a backside of the die paddle, wherein the passivation layer covers a remainder surface of the die paddle exposed from the plastic package body and a bottom surface of the passivation layer is coplanar with a bottom surface of the plastic package body.