CHIP PACKAGE MODULE AND PACKAGE SUBSTRATE

摘要

A chip package module and a package substrate are disclosed herein. The package substrate provides a double-sided wiring structure, wherein a circuit layer is electrically connected with at least one chip, and wherein a heat-conduction wiring layer is extended to the underneath layer so as to increase the heat-conduction area and enhance the heat-dissipation efficiency. The present invention can apply to light emitting diode chips or solar chips to overcome the heat-dissipation problem.

主权项

1. A chip package module comprising
a metallic substrate; a first heat-conduction and electric-insulation layer disposed over said metallic substrate; a heat-conduction wiring layer disposed over said first heat-conduction and electric-insulation layer; a second heat-conduction and electric-insulation layer disposed over said heat-conduction wiring layer; a circuit layer disposed over said second heat-conduction and electric-insulation layer and electrically connected with said heat-conduction wiring layer; at least one chip installed on said circuit layer in a flip-chip way; and an encapsulant covering said chip and a portion of said circuit layer.