发明名称 EXPANDABLE COMPOSITE RESIN BEAD
摘要 An expandable composite resin bead containing an organic physical blowing agent and a base resin composed of a composite resin obtained by polymerizing a styrene monomer in a polypropylene resin. The styrene monomer is polymerized in an amount of more than 400 parts by mass and not more than 1900 parts by mass with respect to 100 parts by mass of the polypropylene resin. The composite resin contains xylene solubles to be obtained through xylene solvent Soxhlet extraction of the expandable composite resin bead, the xylene solubles contain acetone solubles to be obtained through dissolution of the xylene solubles into acetone, and the acetone solubles have an absorbance ratio A (D698/D1376) of an absorbance D698 to an absorbance D1376 that are respectively measured at a wavenumber of 698 cm−1 and 1376 cm−1 as infrared absorption spectra of the acetone solubles within a range of from 8.5 to 23.
申请公布号 US2016053068(A1) 申请公布日期 2016.02.25
申请号 US201514824564 申请日期 2015.08.12
申请人 JSP CORPORATION 发明人 SHIMA Masaomi
分类号 C08J9/22;C08J9/14 主分类号 C08J9/22
代理机构 代理人
主权项 1. An expandable composite resin bead comprising: a base resin composed of a composite resin obtained by polymerizing a styrene monomer in a polypropylene resin; and an organic physical blowing agent, wherein the styrene monomer is polymerized in an amount of more than 400 parts by mass and not more than 1900 parts by mass with respect to 100 parts by mass of the polypropylene resin, the expandable composite resin bead comprises xylene solubles to be obtained through xylene solvent Soxhlet extraction of the expandable composite resin bead, the xylene solubles comprise acetone solubles to be obtained through dissolution of the xylene solubles into acetone, and the acetone solubles have an absorbance ratio A (D698/D1376) of an absorbance D698 to an absorbance D1376 that are respectively measured at a wavenumber of 698 cm−1 and at a wavenumber of 1376 cm−1 as infrared absorption spectra of the acetone solubles within a range of from 8.5 to 23.
地址 Chiyoda-ku JP