发明名称 |
RESIN COMPOSITION, INJECTION MATERIAL AND PACKING METHOD |
摘要 |
The injection material 100 contains particles 2 adapted to be packed into the fracture, a resin composition and a fluid 20 for transferring the particles 2 and the resin composition into the fracture. Further, the resin composition is used for forming a surface layer covering at least a part of an outer layer of each of the particles 2. The resin composition contains an acid-curing agent and an acid-curing resin which can cure in the presence of an acid. The acid-curing agent has an acid group which is present in a state that the acid group is blocked by a compound having reactivity with respect to the acid group. The resin composition can reliably cure the acid-curing resin at a target location, the injection material containing the resin composition and the particles and a packing method for packing the particles into the fracture formed in the subterranean formation. |
申请公布号 |
US2016053161(A1) |
申请公布日期 |
2016.02.25 |
申请号 |
US201414784639 |
申请日期 |
2014.03.28 |
申请人 |
SUMITOMO BAKELITE COMPANY LIMITED |
发明人 |
Maeda Fumihiro;Arita Yasushi;Asami Masakatsu |
分类号 |
C09K8/68;C08G8/10;E21B43/267;C08G16/02 |
主分类号 |
C09K8/68 |
代理机构 |
|
代理人 |
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主权项 |
1. A resin composition used for forming a surface layer covering at least a part of an outer surface of a particle, the particle adapted to be packed into a fracture formed in a subterranean formation, the resin composition comprising:
an acid-curing agent; and an acid-curing resin which can cure in the presence of an acid, wherein the acid-curing agent has an acid group which is present in a state that the acid group is blocked by a compound having a reactivity with respect to the acid group, and wherein a property of the resin composition is set so that the acid-curing resin starts to cure at a temperature in the range of 50 to 110° C. and within time in the range of 2 to 8 hours by adjusting a kind and a contained amount of each of the acid-curing resin, the acid-curing agent and the compound. |
地址 |
Tokyo JP |