VACUUM PROCESSING DEVICE

摘要

A vacuum processing apparatus according to this invention includes a heating unit arranged to face a processing surface of a substrate supported by a substrate support unit in a vacuum chamber, a cooling unit arranged to face a reverse surface of the substrate supported by the substrate support unit, a temperature correction unit configured to correct a temperature of a periphery of the substrate in order to reduce a temperature difference between a central portion and the periphery of the substrate by being arranged in a predetermined position between the substrate and the cooling unit when the heating unit heats the substrate, and a correction unit moving device configured to retract the temperature correction unit from the predetermined position.

主权项

1. A vacuum processing device comprising:
a vacuum chamber; a substrate supporting unit configured to support a substrate in said vacuum chamber; a heating unit arranged to face a processing surface of the substrate supported by said substrate supporting unit; a cooling unit arranged to face a reverse surface of the substrate supported by said substrate supporting unit; a temperature correction unit configured to correct a temperature of a periphery of the substrate in order to reduce a temperature difference between a central portion and the periphery of the substrate by being arranged in a predetermined position between the substrate supported by said substrate supporting unit and said cooling unit when said heating unit heats the substrate; and a correction unit moving unit configured to move said temperature correction unit between the predetermined position and a retraction position retracted from the predetermined position, wherein said substrate supporting unit can move the substrate to a heating position where said heating unit heats the substrate, and a cooling position where said cooling unit cools the substrate, wherein said substrate supporting unit includes: a first support unit configured to support the substrate in the heating position; and a second support unit configured to receive the substrate supported by said first support unit in the heating position, and move the substrate to the cooling position, wherein said correction unit moving unit retracts said temperature correction unit to the retraction position before said second support unit receives the substrate from the first support unit.