ABSORBING TERMINATION IN AN INTERCONNECT

摘要

Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.

主权项

1. A printed circuit board (PCB) assembly comprising:
a substrate; at least one interconnect formed in the substrate to route an electrical signal within the PCB, wherein the interconnect is coupled with a connecting component that is disposed on a surface of the PCB; and an absorbing material that is disposed to be in direct contact with at least a portion of the connecting component.