| 摘要 |
The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing:
(A) an organopolysiloxane including at least two alkenyl groups per molecule, the 25°C kinetic viscosity being 5,000 to 100,000 mm 2 /s;
(B) a hydrolysable methyl polysiloxane, trifunctional at one terminus, represented by general formula (1)
(R 1 is a C 1-6 alkyl group, and a is an integer 5 to 100);
(C) a thermally conductive filler having a thermal conductivity of 10 W/m·°C or greater;
(D) an organohydrogenpolysiloxane containing two to five hydrogen atoms directly bonded to a silicon atom (Si-H group) per molecule;
(E) an adhesion promoter having a triazine ring and at least one alkenyl group per molecule; and
(F) a catalyst selected from the group consisting of platinum and platinum compounds. |
