发明名称 |
Cover Having Metallic Grid Structure and Method for Manufacturing the Cover |
摘要 |
Provided are a cover having a metallic grid structure and a method for manufacturing the cover. The cover (100) includes a pattern portion (110) formed of a metallic material, in which a plurality of patterns (111) are independently disposed spaced apart from each other and an injection portion (120) disposed between pattern portions to connect the pattern portions, the injection portion (120) being formed of a non-metallic material. The method includes forming a pre-pattern portion (105) including patterns (111) in a regular or irregular form and a bridge (112) connecting the patterns on a metallic plate (101), forming the injection portion (120) on the pre-pattern portion (105) by insert-injection or thermo-compression press, and removing the bridge (112). |
申请公布号 |
EP2670116(B1) |
申请公布日期 |
2016.02.24 |
申请号 |
EP20130169087 |
申请日期 |
2013.05.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
HWANG, YONG-WOOK;CHO, SUNG-HO;MOON, HEE-CHEUL;BAEK, SEUNG-CHANG;PARK, CHAN-SEOB |
分类号 |
H04M1/02;B29C45/00;B29C45/14;B29L31/34;H01M2/04;H01Q1/24;H01Q1/42;H01Q15/00 |
主分类号 |
H04M1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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