| 摘要 |
A method for laminating substrates may include disposing a pressure-sensitive adhesive layer (103) between a substantially planar surface of a first substrate (101) and a substantially planar surface of a second substrate (102), disposing the first substrate, the pressure-sensitive adhesive layer, and the second substrate within a vacuum chamber (110), evacuating the vacuum chamber, and applying a pressure to at least one of the first substrate and the second substrate. |
