| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition which gives a cured product having a low linear expansion coefficient. <P>SOLUTION: The curable resin composition includes, as necessary components: (A) an organic compound having at least two carbon-carbon double bonds, reactive with a SiH group, in a molecule; (B) a compound containing at least two SiH groups in a molecule; (C) a hydrosilylation catalyst; (D) a (meth)acrylic polymer having at least one carbon-carbon double bonds, reactive with a SiH group, in a molecule; and (E) an inorganic filler. When the composition is molded on one face of a metal substrate, the warpage can be reduced. <P>COPYRIGHT: (C)2013,JPO&INPIT |
