| 摘要 |
Dual interface modules, and methods for manufacturing the same, are described. A substrate layer is provided with at least one dual interface section. At least two first through-holes are formed in the substrate in each dual interface section. A first connection element is arranged in each first through-hole. Each first connection element is connected to a contact pad that is arranged on a first side of the substrate. Each first connection element is connected to a connection pad that is arranged on a second side of the substrate. At least one electronic element is arranged on the second side of the substrate in each dual interface section. Two second through-holes are formed in the substrate in each dual interface section. Two soldering pads with a first side and a second side are arranged on the second side of the substrate layer. |
