| 发明名称 |
Bond pad structure and method of manufacturing the same |
| 摘要 |
A method of manufacturing a bond pad structure, comprising the steps of forming a pad material layer on a passivation layer, forming a protection layer on the pad material layer, performing an etching process to pattern the protection layer and the pad material layer into a bond pad structure, and removing the protection layer on the bond pad structure. |
| 申请公布号 |
US9269678(B2) |
申请公布日期 |
2016.02.23 |
| 申请号 |
US201213659924 |
申请日期 |
2012.10.25 |
| 申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Wang Ye |
| 分类号 |
H05K1/03;H05K1/09;H05K3/22;H05K1/02;H01L23/00;H01L23/31;H01L21/44;H01L21/28;H01L23/48 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
Hsu Winston;Margo Scott |
| 主权项 |
1. A method of manufacturing a bond pad structure, comprising the steps of:
forming a pad material layer on a passivation layer; forming a protection layer on said pad material layer; after forming said protection layer on said pad material layer, using a photoresist as a mask to perform an etching process for patterning said protection layer and said pad material layer into a bond pad structure; and after patterning said protection layer and said pad material layer, completely removing said protection layer on said bond pad structure. |
| 地址 |
Science-Based Industrial Park , Hsin-Chu TW |
