Method for handling a thin substrate and for substrate capping

摘要

An embodiment is a method for bonding. The method comprises bonding a handle substrate to a capping substrate; thinning the capping substrate; etching the capping substrate; and after the thinning and the etching the capping substrate, bonding the capping substrate to an active substrate. The handle substrate has an opening therethrough. The method also comprises removing the handle substrate from the capping substrate. The removing comprises providing an etchant through the opening to separate the handle substrate from the capping substrate. Other embodiments further include forming a bonding material on a surface of at least one of the handle substrate and the capping substrate such that the capping substrate is bonded to the handle substrate by the bonding material. The bonding material may be removed by using a dry etching to remove the handle substrate from the capping substrate.

主权项

1. A method comprising:
forming a bond between a handle substrate and a first side of a first substrate, the handle substrate having a first opening extending therethrough; processing the first substrate; bonding a second substrate to a second side of the first substrate opposite the first side; and separating the handle substrate from the first substrate by disengaging the bond with a chemical reaction induced by a reactant provided through the first opening.