Monolithic ceramic electronic component

摘要

Solder-repellent portions are each arranged so as to extend over all or substantially all of a portion of a corresponding one of outer electrodes provided on a corresponding one of end surfaces of a monolithic ceramic electronic component and partially on portions of the outer electrode provided over two side surfaces of the monolithic ceramic electronic component. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to the end surfaces and portions of the outer electrode provided on portions of the two side surfaces. Thus, expansion and contraction that occur as a result of application of an AC voltage is not transmitted or is not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are significantly reduced or prevented.

主权项

1. A monolithic ceramic electronic component comprising:
a ceramic laminate body having a cuboid or substantially cuboid shape and including dielectric ceramic layers and internal electrodes alternately stacked on top of one another, the ceramic laminate body including an outer periphery defined by an upper surface, a lower surface, two side surfaces, and two end surfaces that are perpendicular or substantially perpendicular to the upper surface, the lower surface, and the two side surfaces; and an outer electrode disposed on one of the end surfaces and portions of the upper and lower surfaces and portions of the two side surfaces that are continuous with the one of the end surfaces so as to be electrically connected to the internal electrodes; wherein the outer electrode includes a solder-repellent portion to which molten solder does not adhere and a solder-receivable portion to which the molten solder adheres; the solder-repellent portion is arranged so as to extend over all or substantially all of a portion of the outer electrode provided over the end surface and so as to partially extend over portions of the outer electrode provided over the two side surfaces; the solder-receivable portion is provided in a portion of the outer electrode excluding the solder-repellent portion; and the solder-repellent portion is further arranged so as to partially extend over at least one of the upper and lower surfaces.