CHIP COIL COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a chip-type coil component and a manufacturing method thereof. According to an embodiment of the present invention, the chip-type coil component comprises: a ceramic body of which a lower surface is provided as a mounting surface and in which a plurality of ceramic layers with a plurality of penetration grooves provided therein are arranged; and an internal coil portion located in the ceramic body and including internal coil patterns arranged on the plurality of ceramic layers, wherein the plurality of penetration grooves are exposed to the lower surface of the ceramic body, and the plurality of ceramic layers comprise a plurality of conductive materials with which first and second penetration grooves are filled.