发明名称 DEVICE AND METHOD FOR AN INTEGRATED ULTRA-HIGH-DENSITY DEVICE
摘要 A device and method for an integrated device includes a first redistribution layer comprising one or more first conductors, one or more first dies mounted to a first surface of the first redistribution layer and electrically coupled to the first conductors, one or more first posts having first ends attached to the first dies and second ends opposite the first ends, one or more second posts having third ends attached to the first surface of the first redistribution layer and fourth ends opposite the third ends, and a second redistribution layer comprising one or more second conductors, the second redistribution layer being attached to the second ends of the first posts and to the fourth ends of the second posts. In some embodiments, the integrated device further includes a heat spreader mounted to a second surface of the first redistribution layer. The second surface is opposite the first surface.
申请公布号 US2016049383(A1) 申请公布日期 2016.02.18
申请号 US201414532806 申请日期 2014.11.04
申请人 Invensas Corporation 发明人 Woychik Charles G.;Uzoh Cyprian Emeka;Shen Hong;Lattin Christopher W.;Gao Guilian;Katkar Rajesh
分类号 H01L25/065;H01L23/367;H01L21/56;H01L23/31;H01L25/00;H01L23/00 主分类号 H01L25/065
代理机构 代理人
主权项 1. An integrated device, the device comprising: a first redistribution layer comprising one or more first conductors; one or more first dies mounted to a first surface of the first redistribution layer and electrically coupled to the first conductors; one or more first posts having first ends attached to the first dies and second ends opposite the first ends; one or more second posts having third ends attached to the first surface of the first redistribution layer and fourth ends opposite the third ends; and a second redistribution layer comprising one or more second conductors, the second redistribution layer being attached to the second ends of the first posts and to the fourth ends of the second posts.
地址 San Jose CA US