| 发明名称 |
SEMICONDUCTOR DEVICES AND PACKAGE SUBSTRATES HAVING PILLARS AND SEMICONDUCTOR PACKAGES AND PACKAGE STACK STRUCTURES HAVING THE SAME |
| 摘要 |
A semiconductor device, a semiconductor package, and a package stack structure include a semiconductor substrate, a first bonding pad disposed on a first surface of the semiconductor substrate, and a first pillar disposed on the first bonding pad. An upper surface of the first pillar has a concave shape. Side surfaces of the first pillar are substantially planar. |
| 申请公布号 |
US2016049377(A1) |
申请公布日期 |
2016.02.18 |
| 申请号 |
US201514813084 |
申请日期 |
2015.07.29 |
| 申请人 |
KIM Tae-Hyeong;KO Yeong-Kwon;KIM Ji-Hwang;SEO Sun-Kyoung;CHO Tae-Je |
发明人 |
KIM Tae-Hyeong;KO Yeong-Kwon;KIM Ji-Hwang;SEO Sun-Kyoung;CHO Tae-Je |
| 分类号 |
H01L23/00;H01L23/48 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a semiconductor substrate comprising a first surface; one or more first bonding pads disposed on the first surface of the semiconductor substrate; and a first pillar disposed on at least one first bonding pad, an upper surface of the first pillar comprising a concave shape and a side surface of the first pillar being substantially planar. |
| 地址 |
Suwon-si KR |
