Long-term heat treated integrated circuit arrangements and methods for producing the same

摘要

An explanation is given of, inter alia, methods in which the barrier material is removed at a via bottom or at a via top area by long-term heat treatment. Concurrently or alternatively, interconnects are coated with barrier material in a simple and uncomplicated manner by means of the long-term heat treatment.

主权项

1. A method for producing an integrated circuit arrangement, in which heat treatment is effected once or repeatedly, wherein as a result of the heat treatment a barrier material layer between a via conductive structure and an interconnect is removed, perforated or thinned by at least 50%.