| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
There are provided a printed circuit board including: an insulation layer in which a via hole is formed; vias formed in the via hole; first circuit patterns formed below the insulation layer and electrically connected to the vias; and second circuit patterns formed on the insulation layer to be bonded to the vias; wherein the via has a diameter smaller than that of the via hole, and a method of manufacturing a printed circuit board. |
| 申请公布号 |
US2016050755(A1) |
申请公布日期 |
2016.02.18 |
| 申请号 |
US201514824598 |
申请日期 |
2015.08.12 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
KANG Myung Sam;LEE Young Kwan;LEE Seung Eun;KOOK Seung Yeop |
| 分类号 |
H05K1/11;H05K3/42;H05K1/09;H05K1/02;H05K1/03 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
an insulation layer in which a via hole is formed; vias formed in the via hole; first circuit patterns formed below the insulation layer and electrically connected to the vias; and second circuit patterns formed on the insulation layer to be bonded to the vias; wherein the via has a diameter smaller than that of the via hole. |
| 地址 |
Suwon-Si KR |
