| 摘要 |
The present invention relates to a method to manufacture an LED device, capable of manufacturing an LED device by forming a fluorescent layer on an LED chip. According to the present invention, the method includes: a step (a) of preparing multiple LED chips, individually cut on a wafer; a step (b) of preparing multiple fluorescent covers, made of synthetic resin materials mixed with fluorescent materials in order to cover the upper surfaces of the LED chips, according to the thickness of the fluorescent cover and a mixture amount of the fluorescent materials; a step (c) of measuring a color coordinates value of each of the LED chips; a step (d) of selecting a fluorescent cover, able to form a target color coordinates value by being applied to the LED chip of which color coordinates value is measured at the step (c), among multiple fluorescent covers; and a step (e) of forming an LED device by attaching the selected fluorescent cover to the LED chip. |
