| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a resin casette from being mistakenly taken when wafers subjected to a cooling process are moved from a metal cassette to the resin cassette. <P>SOLUTION: A wafer cooling storage 1 has an upper side space and a lower side space. Wafers 40 are moved from a resin cassette 30A to a metal cassette 20A to subject them to a bake process, and the resin cassette 30A is stored in the lower side space of the wafer cooling storage 1 to which a temperature identification display 11 corresponding to a bake temperature is attached. The metal cassette 20A subjected to the bake process is housed in the upper side space for cooling them. After the cooling, the wafers 40 in the metal cassette 20A in the upper side space are moved to the resin cassette 30A in the lower side space. <P>COPYRIGHT: (C)2013,JPO&INPIT |
