发明名称 SYSTEMS AND METHODS FOR ENCAPSULATING ELECTRONICS IN A MOUNTABLE DEVICE
摘要 A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure includes an electronic component having electrical contacts, sensor electrodes, and electrical interconnects between the sensor electrodes and the electrical contacts. The bio-compatible structure is fabricated such that it is fully encapsulated by a bio-compatible material, except for the sensor electrodes. In the fabrication, the electronic component is positioned on a first layer of bio-compatible material and a second layer of bio-compatible material is formed over the first layer of bio-compatible material and the electronic component. The electrical contacts are exposed by removing a portion of the second layer, a conductive pattern is formed to define the sensor electrodes and electrical interconnects, and a third layer of bio-compatible material is formed over the conductive pattern. The sensor electrodes are exposed by removing a portion of the third layer.
申请公布号 EP2984476(A1) 申请公布日期 2016.02.17
申请号 EP20140772685 申请日期 2014.02.12
申请人 GOOGLE INC. 发明人 ETZKORN, JAMES
分类号 G01N27/327;A61B3/10;A61B5/00;A61B5/145;G01N27/416;G01N33/487 主分类号 G01N27/327
代理机构 代理人
主权项
地址