| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film forming layer which has high uniformity in thickness, can easily produce a semiconductor chip having a protective film with good print accuracy, and has a heat resistance property. <P>SOLUTION: A dicing sheet consists of: a base film 1 subjected to peeling treatments; a protective film forming layer 4 formed on an inner perimeter of the base film; and an adhesive layer 2 formed an outer perimeter of the base film. The melting point of the base film exceeds 130°C or the base film does not have the melting point, and the thermal shrinkage of the base film heated at 130°C and for 2 hours is -1 to +1%. <P>COPYRIGHT: (C)2013,JPO&INPIT |
