| 摘要 |
<P>PROBLEM TO BE SOLVED: To suitably fill a fine depression on a printed board or the like with copper without causing a void and a concavity. <P>SOLUTION: The method of filling a depression with copper includes immersing an object to be plated in a pretreatment liquid not including an electrodeposition accelerator selected from amides and amino acids and including a brightener selected from sulfides and mercaptans (carrying out preliminary adsorption), or carrying out preliminary plating instead of carrying out the preliminary adsorption, and subsequently electroplating the object to be plated with copper using a copper plating liquid including the electrodeposition accelerator and the brightener, whereby fine depressions on a printed board or the like can suitably be filled with copper. <P>COPYRIGHT: (C)2013,JPO&INPIT |
