| 发明名称 | Semiconductor device including multiple semiconductor chips and a laminate | ||
| 摘要 | A semiconductor device includes a laminate, a first semiconductor chip at least partly embedded in the laminate, a second semiconductor chip mounted on a first main surface of the laminate, and a first electrical contact arranged on the first main surface of the laminate. The second semiconductor chip is electrically coupled to the first electrical contact. | ||
| 申请公布号 | US9263425(B2) | 申请公布日期 | 2016.02.16 |
| 申请号 | US201314102625 | 申请日期 | 2013.12.11 |
| 申请人 | Infineon Technologies Austria AG | 发明人 | Scharf Thorsten;Palm Petteri;Kessler Angela |
| 分类号 | H01L23/48;H01L25/18;H01L23/31;H01L23/552;H01L23/00;H01L25/00;H01L23/538 | 主分类号 | H01L23/48 |
| 代理机构 | Murphy, Bilak & Homiller, PLLC | 代理人 | Murphy, Bilak & Homiller, PLLC |
| 主权项 | 1. A semiconductor device, comprising: a laminate; a first power semiconductor chip at least partly embedded in the laminate; a second power semiconductor chip at least partly embedded in the laminate; a control semiconductor chip configured to control at least one of the first power semiconductor chip and the second power semiconductor chip, the control semiconductor chip mounted on a first main surface of the laminate; and a first electrical contact arranged on the first main surface of the laminate, wherein the control semiconductor chip is electrically coupled to the first electrical contact. | ||
| 地址 | Villach AT | ||