Interlayer communications for 3D integrated circuit stack

摘要

Some embodiments provide capacitive AC coupling inter-layer communications for 3D stacked modules.

主权项

1. An apparatus, comprising:
at least two integrated circuit (IC) layers including a core logic layer and one or more memory layers of different technologies; and a bus to communicatively link the at least two IC layers to each other, the bus including one or more interconnects connected through the at least two IC layers, wherein each layer includes at least one bus interface coupled to the one or more interconnects through coupling capacitors.