发明名称 |
Semiconductor device and method for fabricating the same |
摘要 |
A semiconductor device includes a semiconductor layer formed over a semiconductor substrate. A well region is disposed in a portion of the semiconductor layer, and a plurality of first doped regions is disposed in various portions of the well region. A second doped region is disposed in a portion of the well region. An isolation element is disposed in a portion of the top-most one of the first doped regions, and a third doped region is disposed in a portion of the top-most one of the first doped regions. A fourth doped region is disposed in a portion of the second doped region. An insulating layer overlies the third doped region, the isolation element, the second doped region, and the fourth doped region, and a conductive layer overlies the insulating layer. |
申请公布号 |
US9263574(B1) |
申请公布日期 |
2016.02.16 |
申请号 |
US201414535793 |
申请日期 |
2014.11.07 |
申请人 |
Vanguard International Semiconductor Corporation |
发明人 |
Kumar Manoj;Hung Pei-Heng;Lee Chia-Hao;Liao Chih-Cherng;Tu Shang-Hui |
分类号 |
H01L29/78;H01L29/66;H01L21/336;H01L29/10;H01L29/06;H01L29/49;H01L21/02;H01L21/28 |
主分类号 |
H01L29/78 |
代理机构 |
Birch, Stewart, Kolasch & Birch, LLP |
代理人 |
Birch, Stewart, Kolasch & Birch, LLP |
主权项 |
1. A semiconductor device, comprising:
a semiconductor substrate, having a first conductivity type; a semiconductor layer formed over the semiconductor substrate, having the first conductivity type; a well region disposed in a portion of the semiconductor layer, having a second conductivity type opposite to the first conductivity type; a plurality of first doped regions of the first conductivity type vertically and separately disposed in various portions of the well region, wherein a pitch is between the adjacent first doped regions; a second doped region of the second conductivity type disposed in a portion of the well region, wherein the second doped region is adjacent to the first doped regions; an isolation element disposed in a portion of the top-most one of the first doped regions; a third doped region of the first conductivity type disposed in a portion of the top-most one of the first doped regions, being adjacent to the isolation element; a fourth doped region of the first conductivity type disposed in a portion of the second doped region; an insulating layer overlying a portion of the third doped region, the isolation element, a portion of the second doped region, and a portion of the fourth doped region; and a conductive layer overlying a portion of the insulating layer. |
地址 |
Hsinchu TW |