Multi-layer wiring board

摘要

A multi-layer wiring board includes a resin base, a wiring pattern, an adhesive layer, and a via. The wiring pattern includes a land provided on the resin base. The adhesive layer is stacked on the resin base. The via is formed in the adhesive layer and has an end connected to the land. At least a portion of a side surface of the land contacts the via.

主权项

1. A multi-layer wiring board, comprising: a first resin base; a wiring pattern provided on the first resin base and including a land; an adhesive layer on which the first resin base is stacked; a second resin base disposed on the adhesive layer opposite to the first resin base; and a via formed in the adhesive layer and having an end connected to the land, at least a portion of a side surface of the land contacting the via, wherein only a part of the side surface of the land contacts the via and only a part of a bottom surface of the land contacts the via, and wherein the land is embedded in the via and a diameter of the land is smaller than a diameter of the via.