Method of manufacturing an embedded printed circuit board

摘要

An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched to form a circuit pattern region and a second step of filling the circuit pattern region with a plating material to form a circuit pattern. Accordingly, the method of manufacturing an embedded PCB can simultaneously or sequentially etch a photoresist layer and an insulating layer using a laser to form a circuit pattern so as to obtain a micro pattern and simplify a manufacturing process and achieve alignment accuracy in construction of a multi-layer PCB using the embedded PCB to thereby improve product reliability and yield.

主权项

1. A method of manufacturing an embedded printed circuit board (PCB), comprising:
a first step of laser-patterning an insulating layer and a photoresist layer laminated on the insulating layer together to form a circuit pattern region in which a part of the insulating layer is etched; a second step of forming a metal seed layer on the insulating layer on which the circuit pattern region is formed, and filling the circuit pattern region with a metal material; a third step of removing the metal seed layer from a top face of a circuit pattern so that the metal seed layer is formed on the remaining surface except for the top face of the circuit pattern, thereby forming a first printed circuit board; and a fourth step of disposing the first printed circuit board on a first surface of an inner circuit board, wherein the method further comprises: forming a second printed circuit board by the first through third steps; and disposing the second printed circuit board on a second surface of the inner circuit board opposite to the first surface.