Substrate-less stackable package with wire-bond interconnect

摘要

A method for making a microelectronic unit includes forming a plurality of wire bonds on a first surface in the form of a conductive bonding surface of a structure comprising a patternable metallic element. The wire bonds are formed having bases joined to the first surface and end surfaces remote from the first surface. The wire bonds have edge surfaces extending between the bases and the end surfaces. The method also includes forming a dielectric encapsulation layer over a portion of the first surface of the conductive layer and over portions of the wire bonds such that unencapsulated portions of the wire bonds are defined by end surfaces or portions of the edge surfaces that are uncovered by the encapsulation layer. The metallic element is patterned to form first conductive elements beneath the wire bonds and insulated from one another by portions of the encapsulation layer.

主权项

1. A microelectronic package comprising:
at least one microelectronic element; first conductive elements including terminals exposed at a mounting surface of the package, at least some of the first conductive elements being electrically connected to the at least one microelectronic element through vias integrally formed with the first conductive elements; wire bonds having bases joined to respective ones of the first conductive elements and adjacent a first surface of a dielectric layer, the wire bonds having end surfaces remote from the bases, each of the wire bonds respectively defining an edge surface extending between a base and an end surface respectively thereof; and the dielectric layer having the first surface and a second surface remote from the first surface, at least a portion of the first surface being exposed at the mounting surface of the package, the dielectric layer filling spaces between the wire bonds separated from one another by the dielectric layer, wherein unencapsulated portions of the wire bonds at end surfaces thereof being uncovered by the dielectric layer at the second surface thereof.