The present invention relates to a printed circuit board. The printed circuit board comprises an insulating substrate; a first circuit pattern formed on one surface of the insulating substrate; a second circuit pattern which is formed on the other surface of the insulating substrate; and an element which is arranged from the inside of the insulating layer to one side of the insulating substrate.
申请公布号
KR20160016032(A)
申请公布日期
2016.02.15
申请号
KR20140099185
申请日期
2014.08.01
申请人
LG INNOTEK CO., LTD.
发明人
KOO, KYO HUN;MYEONG, SE HO;SEONG, DAE HYEON;YEO, KI SU;LEE, KYU WON;HAN, JOON WOOK
