发明名称 THIN-TIN TINPLATE
摘要 An iron-containing substrate obtains a thin-tin or a tin alloy by activating a steel substrate surface by being polarized electrically in a composition before plating. The thin-tin tin plate or the tin alloy is electro-plated on the activated surface of the steel substrate. The quantity of pores on the surface of the thin-tin tin plate and the tin alloy is reduced. The objective of the present invention is to increase life span of the steel substrate.
申请公布号 KR20160015337(A) 申请公布日期 2016.02.12
申请号 KR20160005187 申请日期 2016.01.15
申请人 ROHM AND HAAS ELECTRONIC MATERIALS LLC 发明人 LEVEY PETER R.
分类号 C25D5/36;C25D3/30;C25D3/60;C25D7/06 主分类号 C25D5/36
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