| 摘要 |
The present invention relates to a spraying apparatus to spray a printed circuit board (PCB) plating solution comprising: a plating bath to maintain a predetermined water level of a plating solution; a plurality of transfer rollers arranged to transfer a PCB to pass through the plating bath in a predetermined inner height of the plating bath in parallel and to dip the PCB in the plating solution of the plating bath; a plurality of sprayers arranged to spray the plating solution to an upper surface and a lower surface of the PCB; and a pump to circulate and supply the plating solution to the sprayer by pumping the plating solution. The sprayer comprises: a body in which a partition, in which a plurality of penetration holes is formed, forms an upper side opening unit and which has an inner space connected to the penetration hole; a connector connected to the pump by being formed at the one side of the body to be connected to the inner space as the inlet of the plating solution; a spraying board which includes a protrusion unit slidingly combined with a groove formed along with a length direction of the opening unit and a plurality of spraying holes which are the outlets of the plating solution, formed on the surface. A concave step is formed along with an area in which the spraying hole is formed at the lower surface of the spraying board facing the partition of the body. At least one cleaning solution injecting path which penetrates the boundary of the step and the upper surface of the protrusion unit is formed on the spraying board. |
