Composite Lead Frame Structure

摘要

The present invention relates to a structure of a composite lead frame generally having a die bonding layer and a solder layer and may further have an cohesive layer between the die bonding layer and the solder layer. The die bonding layer is made of flex substrate and the solder layer is made of traditional lead frame. Thus, the composite lead frame structure is suitable for the flip chip or wire bonding packaging process of LED and also suitable for semiconductor IC packaging process. It is good in electric and heat conductivity, and also with higher mechanical strength, resulting high pin counts and minimization of resulted IC.

主权项

1. A composite lead frame structure having a die bonding layer and a solder layer, consisting a plurality of lead frame cell with lead frame cell gaps formed in between, each of said lead frame cell gap comprising a first lead frame cell gap, a second lead frame cell gap and a third lead frame cell gap, said third lead frame cell gap being filled with insulating material, said lead frame cell further comprising a die bonding unit and a solder unit, wherein
said die bonding unit comprises a plurality of first conductive leads and a first insulating clearance, said first conductive lead having a plurality of conductive body holes formed therein and also sequentially having an upper metal layer, an upper adhesive layer, a tape layer and a lower adhesive layer formed therein, said first insulating clearance being formed between lead tip of said first conductive lead forming a conductive lead clearance and a tape clearance; said solder unit comprises a plurality of second conductive leads and a second insulating clearance which being formed between lead tips of said second conductive leads; said first conductive leads being vertically aligned with said second conductive leads; and said lower adhesive layer unit being tightly attached with said second conductive leads.