发明名称 MICROPHONE MODULE WITH SOUND PIPE
摘要 A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
申请公布号 US2016044409(A1) 申请公布日期 2016.02.11
申请号 US201514920849 申请日期 2015.10.22
申请人 Invensense, Inc. 发明人 Harney Kieran P.;Sengupta Dipak;Moss Brian;Guery Alain V.
分类号 H04R1/34;H04R19/04;H04R19/00;H04R1/04 主分类号 H04R1/34
代理机构 代理人
主权项 1. A microphone module comprising: a substrate having a first side, and a second side opposite the first side, the substrate having an aperture extending from the first side to the second side to allow sound waves to pass through the substrate; a lid mounted to the first side, the first side and lid defining a first interior volume, the aperture configured to allow sound to enter the first interior volume; a microphone mounted to the first side and within the first interior volume; a sound pipe having an open end to receive sound waves and direct the sound waves toward the aperture; and at least one exterior interface pad on the second side and electrically coupled to the microphone.
地址 San Jose CA US