SUBSTRATE PROCESSING APPARATUS

摘要

Disclosed is a substrate processing apparatus. substrate processing apparatus includes a moving mechanism that moves a wafer in a horizontal direction, coating sections that eject the coating liquid to the wafer, and dry sections that dries the coating liquid, and a controller that controls the drying sections, the coating sections, and the moving mechanism. In each coating section, the wafer is moved in the horizontal direction while causing the coating liquid to be in contact with the wafer so that the coating liquid is coated on the entire surface.

主权项

1. A substrate processing apparatus for coating a coating liquid on a substrate, the apparatus comprising:
a coating section configured to eject the coating liquid to the substrate; a moving mechanism configured to relatively move the substrate and the coating section in a horizontal direction; and a controller configured to control the coating section and the moving mechanism, wherein the controller controls the coating section and the moving mechanism to perform a firs(step of ejecting and coating the coating liquid at least on an outer peripheral portion of the substrate from the coating section, and a second step of coating the coating liquid on an entire surface of the substrate by relatively moving the substrate and the coating section in the horizontal direction by the moving mechanism while causing the coating liquid ejected from the coating section to be in contact with the substrate.